1. Contact the manufacturer You first need to contact the manufacturer, and then register the customer number, then someone will quote for you, place an order, and follow up the production progress. 2. Cutting purpose: according to the requirements of the engineering data MI, cut into small pieces to produce plates on large sheets that meet the requirements. Small sheets that meet customer requirements. Process: large sheet → cutting board according to MI requirements → curium board → beer fillet\grinding → exit board 3. Drilling purpose: according to the engineering data, drill out of the place on the sheet with the required size according to the engineering data The required aperture. Process: laminated board pin → upper board → drilling → lower board → inspection\repair Fourth, sink copper Purpose: sink copper is to deposit a thin layer of copper on the insulating hole wall by chemical method. Process: rough grinding → hanging board → automatic copper sinking line → lower board → immersion in% dilute H2SO4 → thickened copper 5. Graphic transfer purpose: Graphic transfer is the process of transferring images on the production film to the board: (blue oil process): grinding Board→Printing the first side→drying→Printing the second side→drying→explosion→printing→inspection; (dry film process): hemp board→pressing film→standstill→alignment→exposure→standstill→printing →Check VI. Purpose of pattern plating: Pattern plating is to electroplate a copper layer with the required thickness and a gold-nickel or tin layer with the required thickness on the exposed copper skin or hole wall of the circuit pattern. Process: upper board → degreasing → water washing twice → micro-etching → water washing → pickling → copper plating → water washing → pickling → tin plating → water washing → lower board Seven. Purpose of film removal: use NaOH solution to remove the electroplating coating film Expose the non-circuit copper layer. Process: water film: insert rack → soak alkali → rinse → scrub → pass machine; dry film: release board → pass machine 8. Etching purpose: etching is to use chemical reaction to corrode the copper layer of non-line parts. 9. Green oil purpose: Green oil is to transfer the graphic of the green oil film to the board to protect the circuit and prevent the tin on the circuit when welding parts. Process: grinding plate → printing photosensitive green oil → curium plate → exposure → punching Shadow; grinding board→printing the first side→baking board→printing the second side→baking board 10.The purpose of the characters: the characters are provided with a marking process that is easy to identify: after the green oil finishes→cooling and standing→adjusting the screen → Printed characters → Back eleven. Gold-plated fingers Purpose: to plate a layer of nickel/gold layer of required thickness on the plug fingers to make them more hard and wear-resistant. Process: upper plate → degreasing → washing twice → Micro-etching→washing twice→pickling→copper plating→washing→nickel plating→washing→gold-plated tin plate (a parallel process) Purpose: spray tin is to spray one on the bare copper surface that is not covered with solder mask Layer lead tin to protect the copper surface from corrosion and oxidation to ensure good soldering performance. Process: micro-etching→air drying→preheating→rosin coating→solder coating→hot air leveling→air cooling→washing and air drying.12. Forming purpose: forming the shape required by the customer through die stamping or CNC gong machine. Organic Gongs, beer boards, hand gongs, hand-cutting instructions: The data gongs machine board and beer board have higher accuracy. The hand gongs are second, and the minimum hand-cutting board can only be made with some simple shapes. 13. Test purpose: to pass electronic 100% test to detect defects that affect functionality such as open circuits and short circuits that are not easy to find visually. Process: upper mold → placing board → test → qualified → FQC visual inspection → unqualified → repair → return test → OK → REJ → scrap 14. Purpose of final inspection: pass 100% visual inspection of board appearance defects and detect minor defects Make repairs to avoid the outflow of problematic and defective panels. Specific work flow: incoming materials → view information → visual inspection → qualified → FQA spot check → qualified → packaging → unqualified → processing → inspection OK