1. Degreasing (temperature 60-65°C) 1. Excessive foaming: Abnormal quality caused by excessive foaming: It will lead to poor degreasing effect, and the reason: it is caused by the wrong bath. 2. There is particulate matter composition: There is particulate matter composition. Reasons: the filter is broken or the high-pressure water washing of the plate grinding machine is insufficient, and the outside brings dust. 3. Fingerprints can't get rid of oil: Fingerprints can't get rid of oil. Reasons: low oil removal temperature and wrong syrup. 2. Micro-etching (NPS 80-120G/L H2SO4 5% temperature 25-35℃) 1. The copper surface of the board is slightly white: the reason is the grinding of the board, insufficient oil removal or pollution, and low concentration of the medicine. 2. The copper surface of the board is black: after degreasing, it is not clean and contaminated by degreasing. A pink copper surface is a normal effect of microetching. 3. Activation (the color of the tank liquid is black, the temperature should not exceed 38°C, and the gas cannot be pumped) 1. The tank liquid has precipitation and clarification: the reason for the precipitation of the tank liquid: (1) The concentration of water palladium changes immediately and the content is low (Pre-soak is used for normal replenishment level) (2) Sn2+ concentration is low, Cl- content is low, and temperature is too high. (3) Too much air is introduced to cause oxidation of palladium. (4) Contaminated by Fe+. 2. A silver-white film appears on the surface of the potion: A silver-white film appears on the surface of the potion. Reason: Pd is oxidized to produce oxide. 4. Speeding up (treatment time 1-2 minutes, temperature 60-65°C) 1. No copper in the hole: Reason: The accelerated treatment time is too long, and Pd is also removed when Sn is removed. 2. Pd is easy to fall off at high temperature. V. Chemical copper tank chemical liquid is contaminated. Reasons for chemical liquid contamination: 1. Insufficient washing before PTH; 2. Pd water is brought into the copper cylinder; 3. A board is dropped; 4. Long-term no bombing; 5. Insufficient filtration ; Wash the tank: soak in 10% H2SO4 for 4 hours, then neutralize with 10% NaOH, and finally clean with water. 6. Reasons for the hole wall not sinking copper: 1. Poor degreasing effect 2. Insufficient slag removal 3. Excessive slag removal 7. Reasons for the separation of hole copper and hole wall after thermal shock: 1. Poor slag removal; 2. The substrate has poor water absorption performance; 8. There are strip water patterns on the surface of the board. Reasons: 1. The hanger is not properly designed; 2. The copper sink is stirred too much; 3. The washing is insufficient after acceleration; 9. The temperature of the chemical copper liquid is too high High will cause the chemical copper solution to quickly decompose, and change the composition of the solution and affect the quality of the electroless copper plating. High temperature will also produce a large amount of copper powder, resulting in copper particles on the board surface and in the hole. Generally controlled at 25-35℃. <<>